Thermal Conductivity
Thermal Conductivity as compared to other materials of construction used in temperature controlled packaging.
Testing Method: ASTM C518 Determining the Thermal Conductivity of a Given Material of Construction:
| Thermal Conductivity @20°C | Density | |||
| Foam Type | (W/m K) | (Kg/m^3) | Pounds per Cubic Foot (PCF) | Material Source |
| Poly Urethane (PU) (Marketplace Shipper) |
0.0240 | 31.83 | 1.99 | market specimen |
| Expanded Polystyrene (EPS) (Marketplace Shipper) |
0.0453 | 28.92 | 1.81 | market specimen |
| High Density HD Phenolic Panel (Thermally Treated) |
0.0358 | 44.56 | 2.78 | Dedicated product |
| Temprecision® Foam | 0.0397 | 20.48 | 1.28 | Dedicated product |
EXPLORE OTHER TEMPRECISION® FOAM Properties
Reliability you can depend on
Dimensional Stability of Products
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Thermal Stability on the Surface of Passive Refrigeration
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Absorbing PCMs
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Will not Melt or Lose all of the Fluid if Compromised
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Increase your efficiency
Customizable to any Shape or Size
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Can Absorb with High Efficiency
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Thermal Conductivity
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Non-Toxic
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Maximizing the Internal Volume
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